MediaTek recently announced the Dimensity 9000 chipset and has scheduled an event to launch on December 16 in China. Now the company seems to be working on another chipset, the Dimensity 7000.
The Dimensity 9000 is based on the 4nm technology from TSMC and the ARMv9 architecture with a powerful Cortex-X2 mega-core, three Cortex-a710 large cores (2.85 GHz) and four Cortex-A510 energy saving cores and can accommodate up to Process 7500 LPDDR5X memory at up to 7500 Mbps.
The Dimensity 9000’s image signal processor is a very efficient flagship 18-bit HDR ISP with a processing speed of 9 billion pixels per second, capable of recording HDR video from three cameras (supporting 320 million pixels) simultaneously. The Dimensity 9000 has an embedded Mali-G710 Deca-Core GPU and a mobile-friendly LightChase SDK package that can easily process FHD + displays with 180 Hz and high refresh rate.
In addition, the MediaTek Dimensity 7000 is also in the works, the publication of which cannot be ruled out on this occasion. MediaTek Dimensity 7000 specifications were also released today by Digital Chat Station. The SoC is expected to compete with Qualcomm’s Snapdragon 870 mobile platform.
According to Leaks, the latest prototype is manufactured in the TSMC 5nm process, has four A78 cores with 2.75 GHz and four A55 cores with 2.0 GHz and uses the Mali-G510 MC6-GPU and the new architecture from ARM.